The TetraMem MLX200 chip on its evaluation board

Compute where the weights live.

TetraMem runs AI inside multi-level memristor arrays. The model's weights never travel to a processor, so devices get real-time AI on a fraction of the power.

Meet MLX200
MLX200Silicon validated on TSMC 22nm
2,048Conductance levels in one memristor cell
Nature · SciencePeer-reviewed results since 2023

Partners and investors

  • TSMC
  • SK hynix
  • Synopsys
  • Lam Research

Today's AI chips spend most of their energy moving data.

In a conventional processor, a model's weights sit in memory and travel to the compute units for every calculation. At the edge, that traffic drains batteries, adds heat and slows responses. TetraMem removes the trip.

Up to90%

of the power in conventional AI hardware is lost moving data, not computing on it.

Conventional chip

MemoryCompute
Weights move for every operationMemory and compute are separate. Every multiply needs a round trip over the bus.

TetraMem

Weights stay put. The math happens in place.The memory array does the multiply-and-add itself, in the analog domain.

The memory array is the processor.

A memristor crossbar is a grid of tiny programmable resistors. TetraMem uses it to run the core operation of every neural network, the matrix-vector multiply, in a single analog step.

  1. 01

    Store

    Each memristor holds one model weight as a conductance level. TetraMem cells hold up to 2,048 distinct levels.

  2. 02

    Apply

    Input values arrive as voltages on the rows of the array.

  3. 03

    Multiply and add

    Ohm's law multiplies each input by its weight. Kirchhoff's law adds the currents on each column. Every column computes at once.

  4. 04

    Read out

    A converter at the end of each column turns the summed current into a digital value for the next layer.

Read the full explainer
V1V2V3V4V5V6V7V8I1I2I3I4I5I6I7I8
Input voltages Weights as conductance Summed currents

MLX200

The first multi‑level RRAM in‑memory computing chip on 22nm.

MLX200 puts TetraMem's RRAM compute arrays next to mixed-signal compute engines and a RISC-V vector CPU, on TSMC 22nm. Tape-out, manufacturing and first silicon validation are complete.

MLX200 on the TetraMem evaluation board
Process
TSMC 22nm
Compute
Multi-level RRAM arrays with mixed-signal compute engines
Control
Andes NX27V RISC-V vector CPU
Software
ONNX models in. INT8 and INT4 quantization. C++ and RISC-V executables out.
Status
Silicon validated May 2026. Evaluation kits in the second half of 2026.
Two MLX200 chips next to a US nickel
MLX200 next to a US nickel.

Multi-level RRAM memory IP

The same RRAM technology is available as an IP block for evaluation and licensing.

Ask about licensing

Built for devices that run on a battery.

When AI runs on the device, it answers faster, keeps data private and works offline. MLX200 makes that possible inside a small power budget.

  • Wireless earbuds and their charging case

    Hearables and audio

    Always-on voice and audio processing in earbuds and headsets.

  • A smartwatch with its health sensor lit

    Wearables and health

    Continuous health monitoring, processed on the wrist.

  • A pair of AR smart glasses

    AR and VR

    Low-latency vision and sensing in headsets and smart glasses.

  • An industrial smart sensor with a camera lens

    Smart sensors and IoT

    Sensors that decide locally, so only results leave the device.

  • Chiplets on a data-center server blade

    Edge to cloud

    The roadmap scales to 12, 6 and 3nm, and to chiplets for data-center inference.

Building a device that needs AI on a power budget?

Tell us about your product. Our engineers will show you what MLX200 can do for it.

Concept by AdamX